Polyimide Tape

Product Name	Model  No	Film Thickness (mm)	Total Thickness (mm)	Adhesion to Steel (N/25mm)	Tensile Strength (kg/25mm)	Elongation at Break (%)	Temperature Resistance (℃)	Equivalent
Polyimide tape	WK200-1A	0.015	0.030	2.8	10	25-35	260	—
	WK200-1B	0.015	0.035	3.5	10	25-35	260	—
	WK200-2A	0.025	0.042	2.5-3.5	10-13	45	260	—
	WK200-2B	0.025	0.050	4.0	10-13	45	260	3M98C-12
	WK200-2C	0.025	0.055	5.0	10-13	45	260	—
	WK200-2D	0.025	0.06	5.5	10-13	45	260	3M7413D
	WK200-2E	0.025	0.065	6.0	10-13	45	260	—
	WK200-2F	0.025	0.070	6.5	10-13	45	260	3M98C-1
	WK200-3A	0.05	0.08	6.0	20	55-65	260	—
	WK200-3B	0.05	0.10	6.5	20	55-65	260	—
	WK200-4	0.075	0.12	6	28	60-65	260	—
	WK200-5	0. 10	0.15	6	36	70-75	260	—
	WK200-6	0.125	0.18	6	40	80-85	260	—
	WK200-2DA	0.025	0.06	5.0	10-13	45	260	—
	WK200-2DB	0.025	0.06	5.0	10-13	45	260	—

Polyimide tape (often called Golden Finger Tape) is the core category of special adhesive products, with high temperature resistance, acid and alkali resistance and strong insulation, which is suitable for high-end manufacturing scenes and meets the high requirements of special adhesives. Its uses cover many core fields such as electronics and new energy. The specific categories are as follows:

Electronic and Electrical Industry

This is the main use of polyimide tape, which adapts to the strict requirements of precision electronic manufacturing, especially to the processing requirements of high-end electronic components.

Circuit board (PCB) processing: The core is used for gold finger protection. After the plug-in end (gold finger) of the circuit board is plated with gold/tin, adhesive tape is applied to prevent corrosion and contamination during welding and electroplating. After welding, no residual glue can be easily peeled off, which is necessary for PCB process. At the same time, it can be used for local shielding protection during wave soldering and reflow soldering of circuit boards.

Insulation and fixation of electronic components: Adapt to resistors, capacitors, inductors, chips and other components for pin insulation and solder joint shielding to avoid short circuit. It can also fix electronic flat cables and wire harnesses, which is resistant to high temperature and does not release harmful substances, and is suitable for internal wiring of high-end electronic equipment.

Lithium battery manufacturing: In the processing of soft-package lithium batteries and cylindrical lithium batteries, it is used for battery lug insulation and battery wrapping and fixing, which can withstand the high-temperature process when battery is packaged, and has the characteristics of electrolyte corrosion resistance to ensure the safety and stability of batteries.

High-temperature electronic process shielding: When spraying, baking and sandblasting electronic components, it is used to shield and protect the parts that do not need to be treated. It can withstand high temperature, with no residual glue or damage to the substrate after shielding.

New Energy Industry

Meet the high requirements of the new energy industry for temperature resistance, weather resistance and insulation, and adapt to the manufacture of high-end new energy products.

Photovoltaic module: It is used for shielding protection when photovoltaic cells are welded in series, and it is resistant to high-temperature welding process, ultraviolet rays and high-low temperature cycles, so as to meet the long-term use requirements of outdoor photovoltaic modules. It can also be used for insulation and sealing assistance of assembly frame and junction box.

New energy vehicles: Used in on-board motors and electronic control systems for line insulation and high components.

Power battery packs: Used for insulation and isolation between batteries and modules, withstanding high and low temperatures and vibration while the vehicle is driving.

Hydrogen energy equipment: It is used for shielding and insulation in high-temperature processes when the core components of fuel cells are processed, withstanding corrosion in hydrogen environments and ensuring equipment stability.

Industrial Manufacturing and Processing

It is suitable for all kinds of industrial high-temperature processes, with strong universality and customization requirements.

Metal processing: When metal parts are sprayed, electrophoresed and electroplated at high temperature, the tape shields and protects non-processed surfaces without reacting with metal substrates. It can also protect surfaces during metal stamping and bending to prevent scratching.

Plastics and composite materials: During molding of high-temperature plastics and carbon-fiber composites, it is used for mold shielding and product positioning. It withstands high molding temperatures and peels cleanly to preserve a smooth product surface.

High-temperature baking and curing: It covers areas that do not require curing during high-temperature baking of hardware, plastics and coatings, adapting to different baking processes.

Other High-End Uses

Semiconductor manufacturing: Used for wafer surface shielding and pin insulation in semiconductor wafer cutting and packaging processes, with high-temperature resistance and high cleanliness.

Medical equipment: Used in high-end medical instruments to insulate and secure internal electronic components, withstand high-temperature sterilization and meet medical-grade environmental standards.

High-temperature label substrate: Suitable for labels that must remain in high-temperature environments for long periods, such as engine and boiler parts.

Core Adaptation Advantages

Core characteristics: Wide temperature range, excellent insulation, acid and alkali resistance, salt-fog and ultraviolet resistance, and clean removal without adhesive residue.

Customized adaptation: Thickness, adhesion and temperature resistance can be customized for different industries, processes and application scenarios while maintaining a strong cost-performance advantage.